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Volumn 38, Issue 6-7, 2007, Pages 783-786
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Challenges and performance limitations of high-k and oxynitride gate dielectrics for 90/65 nm CMOS technology
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Author keywords
Gate dielectric materials; HfO2; HfSiON; High k; Mobility; Reliability; SiON
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Indexed keywords
CMOS INTEGRATED CIRCUITS;
DIELECTRIC MATERIALS;
FERMI LEVEL;
LEAKAGE CURRENTS;
PERMITTIVITY;
ULTRATHIN FILMS;
GATE DIELECTRIC MATERIALS;
GATE ELECTRODES;
OXYNITRIDE;
ULTRATHIN OXIDE FILMS;
GATE DIELECTRICS;
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EID: 34547398586
PISSN: 00262692
EISSN: None
Source Type: Journal
DOI: 10.1016/j.mejo.2007.04.012 Document Type: Article |
Times cited : (23)
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References (9)
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