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Volumn 38, Issue 6-7, 2007, Pages 783-786

Challenges and performance limitations of high-k and oxynitride gate dielectrics for 90/65 nm CMOS technology

Author keywords

Gate dielectric materials; HfO2; HfSiON; High k; Mobility; Reliability; SiON

Indexed keywords

CMOS INTEGRATED CIRCUITS; DIELECTRIC MATERIALS; FERMI LEVEL; LEAKAGE CURRENTS; PERMITTIVITY; ULTRATHIN FILMS;

EID: 34547398586     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2007.04.012     Document Type: Article
Times cited : (23)

References (9)
  • 1
    • 4544376583 scopus 로고    scopus 로고
    • D. Matsushita, et al., Novel Fabrication process to realize ultra-thin and ultra-low leakage SiON gate dielectrics, in: VLSI Symposium, 2004, p. 172
  • 2
    • 84930202615 scopus 로고    scopus 로고
    • J. Yugami, et al., Adanced oxynitride gate dielectrics for CMOS applications, in: IWGI, 2003, p. 140.
  • 3
    • 34547396705 scopus 로고    scopus 로고
    • http://public.itrs.net/Files/2003ITRS/Home2003.htm
  • 4
    • 34547414227 scopus 로고    scopus 로고
    • H.Y. Yu, et al., in: IEDM, 2003, p. 99.
  • 5
    • 0024105667 scopus 로고    scopus 로고
    • C. Lombardi, et al., A physically based mobility model for numerical simulation of nonplanar devices, IEEE Trans. Comput.-Aid. Des. 7(11) 1164.
  • 6
    • 0036494552 scopus 로고    scopus 로고
    • Electron and hole mobility in silicon at large operating temperatures part I-bulk mobility
    • Reggiani S., et al. Electron and hole mobility in silicon at large operating temperatures part I-bulk mobility. IEEE Trans. Electron. Dev. 49 3 (2002) 490-499
    • (2002) IEEE Trans. Electron. Dev. , vol.49 , Issue.3 , pp. 490-499
    • Reggiani, S.1
  • 9
    • 17644443159 scopus 로고    scopus 로고
    • S. Joo, et al., Improvement of NBTI and electrical characteristics by ozone pre-treatment and PBTI issues in HfAlO(N) high-k gate dielectrics, in: IEDM, 2003, p. 943.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.