메뉴 건너뛰기




Volumn 101, Issue 12, 2007, Pages

Determining interfacial properties of submicron low- k films on Si substrate by using wedge indentation technique

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CRACK INITIATION; DIELECTRIC FILMS; FRACTURE TOUGHNESS; INCLUSIONS; ION BEAMS; STRAIN; SUBSTRATES;

EID: 34547378141     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2749473     Document Type: Article
Times cited : (31)

References (30)
  • 24
    • 34547252505 scopus 로고    scopus 로고
    • K. S. Kim (private communications).
    • Kim, K.S.1
  • 28
    • 0001792332 scopus 로고
    • edited by J. W.Hutchinson and T. Y.Hu (Academic, New York
    • J. W. Hutchinson and Z. Suo, in Advances in Applied Mechanics, edited by, J. W. Hutchinson, and, T. Y. Hu, (Academic, New York, 1992), p. 63.
    • (1992) In Advances in Applied Mechanics , pp. 63
    • Hutchinson, J.W.1    Suo, Z.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.