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Volumn 101, Issue 12, 2007, Pages
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Determining interfacial properties of submicron low- k films on Si substrate by using wedge indentation technique
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESION;
CRACK INITIATION;
DIELECTRIC FILMS;
FRACTURE TOUGHNESS;
INCLUSIONS;
ION BEAMS;
STRAIN;
SUBSTRATES;
BLACK DIAMOND (BD)FILMS;
INTERFACIAL PROPERTIES;
METHYL-SILSESQUIOXANE (MSQ);
WEDGE INDENTATION TECHNIQUE;
SILICON;
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EID: 34547378141
PISSN: 00218979
EISSN: None
Source Type: Journal
DOI: 10.1063/1.2749473 Document Type: Article |
Times cited : (31)
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References (30)
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