Effects of K4Fe(CN)6 on electroless copper plating using hypophosphite as reducing agent

Journal of Applied Electrochemistry

Volumn 37, Issue 8, 2007, Pages 899-904

  Gan, Xueping ^a   Wu, Yating ^a   Liu, Lei ^a   Hu, Wenbin ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Copper deposits; Electroless copper plating; Hypophosphite; K4Fe(CN)6

Indexed keywords

CATALYTIC OXIDATION; CRYSTALLITE SIZE; DEPOSITION; ELECTRIC CONDUCTIVITY; ELECTROLESS PLATING; MICROSTRUCTURE; POTASSIUM COMPOUNDS; REDUCING AGENTS;

ELECTROCHEMICAL CURRENT-VOLTAGE; ELECTROLESS COPPER PLATING; HYPOPHOSPHITE; PLATING SOLUTIONS;

COPPER PLATING;

EID: 34347262487     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10800-007-9327-z     Document Type: Article

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