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Journal of Applied Electrochemistry

Volumn 32, Issue 3, 2002, Pages 297-303

Kinetics of electroless copper deposition using cobalt(II)-ethylenediamine complex compounds as reducing agents

(3) Vaskelis A a Norkus, E a Jaciauskiene J a

a CENTER FOR PHYSICAL SCIENCES AND TECHNOLOGY (Lithuania)

Author keywords

Cobalt(II); Copper; Copper(II); Electroless deposition; Ethylenediamine

Indexed keywords

AMINES; CATALYSIS; COBALT COMPOUNDS; COMPLEXATION; COPPER; PH EFFECTS; REACTION KINETICS; REDUCTION; STOICHIOMETRY; THERMAL EFFECTS;

COBAL ETHYLENEDIAMINE; ELECTROLESS COPPER DEPOSITION; REDUCING AGENTS;

ELECTROLESS PLATING;

EID: 0036507964 PISSN: 0021891X EISSN: None Source Type: Journal
DOI: 10.1023/A:1015599527638 Document Type: Article

Times cited : (13)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.