Effect of 2,2′-dipyridine on borate-buffered electroless copper deposition

Plating and Surface Finishing

Volumn 90, Issue 3, 2003, Pages 44-47

  Kou, Show Chin ^b   Hung, Aina ^a  

^a TA HWA INSTITUTE OF TECHNOLOGY   (Taiwan)

^b Ta Haw Institute of Technology   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; AROMATIC HYDROCARBONS; BORATE MINERALS; COPPER PLATING; ELECTRIC CONDUCTIVITY; PRINTED CIRCUIT BOARDS;

ELECTROLESS COPPER PLATING;

ELECTROLESS PLATING;

EID: 0037354276     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (20)

1. S.C. Kou & A. Hung, Plating and Surface Finishing, 89, 48 (February 2002).
2. th Edition, Clyde F. Coombs, Ed., McGraw-Hill Inc., New York, NY, 1996.
3. C.A. Deckert, Plating & Surface Finishing, 82, 48 (February 1995).
4. C.A. Deckert, Plating & Surface Finishing, 82, 58 (March 1995).
5. P. Bindra & J. R. White, in Electroless Plating: Fundamentals and Applications, AESF, Orlando, FL, 1990.
6. rd Edition, F.A. Lowenheim, Ed., John Wiley & Sons, New York, NY, 1974.
7. M. Gulla & C. SaVas, U.S. Patent, 4,124,399 (1978).
8. N. Feldstein & J. Weiner, U.S. Patent, 3,720,525 (1973).
9. C.J.G.F. Janssen, H. Jonker & A. Molenaar, Plating, 58, 42 (1971).
10. E.B. Saubestre, Plating, 59, 563 (1972).
11. J. Bielinski & K Kaminski, Surface and Coatings Tech., 31, 223 (1987).
12. S. Mizumoto, et al., Plating, 73, 48 (1986).
13. A. Hung, J. Electrochem. Soc., 132, 1047 (1985).
14. A. Hung, J. Electrochem. Soc., 133, 1350 (1986).
15. K. Kondo, K. Kojima, N. Ishida and M. Irie, Bull. Chem. Soc. Japan, 66, 2380 (1993).
16. M. Oita, M. Matsuoka and C. Iwakura, Electrochimica Acta, 42, 1435 (1997).
17. H.H. Wan, S.H. Yeh, J.Y. Gau & C.Y. Hu, Plating and Surface Finishing, 92, 65 (August 1992).
18. M. Paunovic, Plating, 51, 1161 (1968).
19. S.C. Kou & A. Hung, Plating and Surface Finishing, 88, 119 (May 2001).
20. H. Chang & K-C Hwang, J. Am. Chem. Soc., 106, 6586 (1984).