Cross-sectional nanoindentation for copper adhesion characterization in blanket and patterned interconnect structures: Experiments and three-dimensional FEM modeling

International Journal of Fracture

Volumn 144, Issue 1, 2007, Pages 21-33

  Roy, Sébastien ^a,b   Darque Ceretti, Evelyne ^a   Felder, Eric ^a   Monchoix, Hervé ^b  

^a PSL RESEARCH UNIVERSITY   (France)

^b Alchimer   (France)

Author keywords

Adhesion; Copper; Finite element analysis; Microelectronic; Nanoindentation; Thin films

Indexed keywords

COMPUTER SIMULATION; CRACK PROPAGATION; DELAMINATION; FINITE ELEMENT METHOD; NANOINDENTATION; PLASTIC DEFORMATION; SCANNING ELECTRON MICROSCOPY; THIN FILMS;

COPPER ADHESION CHARACTERIZATION; CROSS-SECTIONAL NANOINDENTATION; INTERCONNECT STRUCTURES;

COPPER;

EID: 34250883383     PISSN: 03769429     EISSN: 15732673     Source Type: Journal    
DOI: 10.1007/s10704-007-9072-7     Document Type: Article

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