System-on-flexible-substrates: Electronics for future smart-intelligent world

2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06

Volumn , Issue , 2006, Pages 29-36

  Zheng, Li Rong ^a   Nejad, Majid B ^a   Rodriguez, Saul ^a   Zhang, Lu ^a   Chen, Cairong ^a   Tenhunen, Hannu ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

DISTRIBUTION OF GOODS; ELECTROMAGNETIC WAVES; EMBEDDED SYSTEMS; INNOVATION; INTERCONNECTION NETWORKS; SENSOR NETWORKS; UBIQUITOUS COMPUTING;

EMBEDDED SMART SYSTEMS; POWER SCAVENGING SYSTEM; RADIO-FREQUENCY IDENTIFICATION;

INTELLIGENT AGENTS;

EID: 34250866926     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)

1. Zheng, L.-R. and Liu J., "System-on-package: a broad perspective from system design to technology development" Microelectronics Reliability, vol.43, 2003. pp-1339-1348.
2. Zheng L.-R. and Tenhunen H., "Single level integrated packaging modules for high performance electronic systems" IEEE Transactions on Advanced Packaging, Vol.24, pp.477-485, 2001.
3. Zheng, L.-R, Duo X., Meigen Shen, Wim Michielsen, and Hannu Tenhunen, "Cost and Performance Trade-off Analysis in Radio and Mixed-Signal System-on-Package Design", IEEE Trans on Adv. Packaging, Vol.27, N0.2, pp.364-375, May 2004.
4. Zheng L.-R. and Tenhunen H., "Seamless electronic integration for next generation integrated systems," in Proc. Electronics Production and Packaging Technology Conference, pages 197-202, Pori, Finland, May 2001.
5. Multiple providers, for example, from Spirea AB (now Firstpass Semiconductor AB), Stockholm, Sweden.
6. X.Duo, L.R. Zheng, M. Ismail, H. Tenhunen, "On-chip versus off-chip passives in multi-band radio design". Proc. 30th European Solid State Circuits Conference, Leuven, Belgium, Sep 2004.
7. Ian Oppermann, M. Hamalainen, J. linatti, UWB Theory and Applications, Wiley Press, 2004, ISBN 0-470-86917-8
8. FCC 04-48, "First Report and Order in the Matter of Revision of Part 15 of the Commission's Rules Regarding Ultra-wideband Transmission Systems." Feb.14, 2002.
9. A. Mohammadian, A. Rajkotia, S. Soliman "Characterization of UWB Transmit- Receive Antenna System", QUALCOM Incorporated, May 2003
10. A. Ismail, A. Abidi, "A 3 to 10 GHz LNA using a wideband LC-ladder matching network", ISSCC. 2004 IEEE International, pp. 384 - 534, Vol. 1, 2004
11. A. Kuthi, M. Behrend, T. Vernier, M. Gundersen, "Bipolar Nanosecond Pulse Generation using Transmission Lines for cell electro-manipulation," 26th International Power Modulator Symposium, May 23, 2004.
12. H. Doh, Y. Jeong, S. Jung and Y. Joo, "Design of CMOS UWB Low Noise Amplifier with Cascode Feedback", MWSCAS '04, vol.2, pp.641 - 644, 2004
13. R.J. Baker, H. W. Li, D. E. Boyce, CMOS Circuit Design, Layout, and Simulation, IEEE Press, 1998, ISBN 0-7803-3416-7
14. X.Duo, L.R. Zheng, H. Tenhunen, L.Chen, G.Zou, J.Liu, "Design and Implement of a 5GHz RF receiver front-end in LCP based System-on-Package Module with Embedded Chip Technology" Proc. IEEE Electrical Performance of Electronic Packaging 2003, Princeton, USA, Oct. 2003, pp 55-58.
15. X.Duo, L.-R.Zheng, H.Tenhunen, C.Liu, G.Zou and J.Liu, "Design and Development of Thin Film and LCP-Based System-on-Package Modules for RF/Wireless Application", Proceedings of The 4th Pori Electronics Production and Packaging Technology Conference, 22-23 May. 2003, pp.205-213.
16. th ECTC Conference.
17. X.Duo, L.R. Zheng, H. Tenhunen, "Chip-Package Co-Design of Common Emitter LNA in System-on-Package with On-Chip versus Off-Chip Passive Component Analysis", Proc. IEEE Electrical Performance of Electronic Packaging 2003, Oct, 2003, Princeton, USA, pp. 51-54.
18. Tommi Torrika, Xinzhong Duo, L.-R. Zheng, Esa Tjukanoff, and H. Tenhunen. Chip-package co-design of a concurrent LNA in system-on-package for multiband radio applications, In Proc. IEEE/EIA 54th Electronic Components and Technology Conference, Las Vegas, NV, USA, June 2004.