On-chip versus off-chip passives in multi-band radio design

ESSCIRC 2004 - Proceedings of the 30th European Solid-State Circuits Conference

Volumn , Issue , 2004, Pages 327-330

  Duo, Xinzhong ^a   Torikka, Tommi ^a   Zheng, Li Rong ^a   Ismail, Mohammed ^b   Tenhunen, Hannu ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b Spirea AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

BROADBAND AMPLIFIERS; CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; ELECTRIC IMPEDANCE; LOCAL AREA NETWORKS; MICROPROCESSOR CHIPS; PASSIVE NETWORKS; SEMICONDUCTING GALLIUM; SPURIOUS SIGNAL NOISE; SWITCHING CIRCUITS; WIRELESS TELECOMMUNICATION SYSTEMS;

MULTI-BAND RADIO; OFF-CHIP PASSIVES; SYSTEM-ON-CHIP (SOC); SYSTEM-ON-PACKAGE (SOP);

RADIO SYSTEMS;

EID: 17644383746     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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6. L.-R. Zheng, X. Duo, M. Shen, W. Michielsen, and H. Tenhunen, "Cost and Performance Trade-off Analysis in Radio and Mixed-Signal System-on-Package Design," IEEE Transactions on Advanced Packaging,(accepted), May. 2004.