Design and implementation of a 5GHz RF receiver front-end in LCP based system-on-package module with embedded chip technology

Electrical Performance of Electronic Packaging

Volumn , Issue , 2003, Pages 51-54

  Duo, Xinzhong ^a   Zheng, Li Rong ^a   Tenhunen, Hannu ^a   Chen, Liu ^b   Zou, Gang ^b   Liu, Johan ^b  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

BANDPASS FILTERS; CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; LIQUID CRYSTAL POLYMERS; LIQUID CRYSTALS; PACKAGING;

CONVERSION GAIN; DESIGN AND IMPLEMENTATIONS; ELECTRICAL PERFORMANCE; MICROWAVE PERFORMANCE; QUALITY FACTORS; RECEIVER FRONT-ENDS; RF RECEIVER FRONT-END; THIN-FILM TECHNOLOGY;

SYSTEM-ON-PACKAGE;

EID: 84945297225     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2003.1249998     Document Type: Conference Paper

References (9)

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