Process development and reliability for system-in-a-package using liquid crystal polymer substrate

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 24-28

  Chen, Liu ^a   Duo, Xingzhong ^b   Zheng, Lirong ^b   Lai, Zonghe ^a   Liu, Johan ^c  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^c SWEREA IVF   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER; ETCHING; FINITE ELEMENT METHOD; INDUCTANCE; LIQUID CRYSTAL POLYMERS; MICROPROCESSOR CHIPS; PERMITTIVITY; PHOTOLITHOGRAPHY; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SILICON; THERMAL CYCLING; THERMAL EXPANSION; THIN FILMS; WETTING;

EMBEDDED STRUCTURES; FLIP CHIP BONDING; PHOTOLITHOGRAPHY SPUTTERING; THERMAL EXPANSION COEFFICIENTS;

ELECTRONICS PACKAGING;

EID: 10444287626     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. Tummala, R., and Madisetti, V. K., 1999, "System on Chip or System on Package?", IEEE Design & Test of Computers, April-June 1999, pp. 48-56.
2. st Electronic Components and Technology Conference, pp. 529-534.
3. Tai, K. L., 2000, "System-in-Package (SIP): Challenges and Opportunities", Proceedings of Asia and South Pacific Design Automation Conference, (the ASP-DAC 2000), pp. 191-196.
4. Fillion, R. A., Wojnarowski, R. J., Gorcyzca, T. B., Wildi, E. J., and Cole, H. S., 1995, "Development of a Plastic Encapsulated Multchip Technology for High Volume, Low Cost Commercial Electronics", IEEE Transaction on CPMT, Part B, 18(1), pp. 59-65.
5. Chen, L., Crnic, M., Lai, Z., and Liu, J., 2002, "Process Development and Adhesion Behavior of Electroless Copper on Liquid Crystal Polymer (LCP) for Electronic Packaging Application", IEEE Transactions on Electronics Packaging Manufacturing, 25(4), pp. 273-278.
6. th International Symposium on Advanced Packaging Materials, March 3-6, 2002, Atlanta, USA, pp. 337-341.
7. Liu, J., Chen, L., Zou, G., and Kivilahti J., "Mechanical, Thermal and Electrical Issues in System-in-a-Package on Low-Cost Liquid Crystal Polymer Substrate", Proceedings of EuroSIME2003 (IEEE/ASME), March 30 - April 2, Aix-en-Provence, France
8. Tuominen, R., and Kivilahti, J. K., 2000, "A Novel IMB Technology for Integrating Active and Passive Components", Adhesive Joining and Coating Technology in Electronic Manufacturing, Proceedings of 4th International Conference on Adhesives in Electronics, pp. 269-273.
9. Chen, L., Andrae, A., Zou, G., and Liu, J., "Characterization of Substrate Materials for System-in-a-Package Applications'. Accepted by Journal of Electronic Packaging, July 2003.