Chip-package co-design of a concurrent LNA in system-on-package for multi-band radio applications

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1687-1692

  Torikka, Tommi ^a,b   Duo, Xinzhong ^b   Zheng, Li Rong ^b   Tjukanoff, Esa ^a   Tenhunen, Hannu ^b  

^a UNIVERSITY OF TURKU   (Finland)

^b ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFIERS (ELECTRONIC); EMBEDDED SYSTEMS; INSERTION LOSSES; LIQUID CRYSTAL POLYMERS; MICROPROCESSOR CHIPS; PASSIVE FILTERS; THIN FILMS; TRANSCEIVERS;

FREQUENCY RANGE; LOW NOISE AMPLIFIER (LNA); PASSIVE COMPONENTS; WIDEBAND;

ELECTRONICS PACKAGING;

EID: 10444241854     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

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