Via processing effects on electromigration in 65 NM technology

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2006, Pages 103-106

  Lee, Ki Don ^a   Park, Young Joon ^a   Kim, Tae ^a   Hunter, William R ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

65 nm node; Cu interconnects; Electromigration; Reliability

Indexed keywords

BOTTOM INTERFACE; CU INTERCONNECTS; DIFFUSION PATH;

CATHODES; ELECTRIC BREAKDOWN; ELECTRIC POWER SYSTEM INTERCONNECTION; ELECTROMIGRATION; ELECTRON TRANSPORT PROPERTIES; PHYSICAL VAPOR DEPOSITION;

INTEGRATED CIRCUIT LAYOUT;

EID: 34250700039     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2006.251199     Document Type: Conference Paper

References (13)

1. A. H. Fisher, A. von Glasow, S. Penka, F. Ungar, 2005 International Interconnect Technology Conference, 2003, pp. 253-255
2. D.-Y. Kim, S. Wong, 2005 International Interconnect Technology Conference, 2003, pp. 265-267
3. th Annual, 2002, pp. 298-304
4. E. T. Ogawa, K.-D. Lee, H. Matsuhashi, K.-S. Ko, P. R. Justison, A. N. Ramamurthi, A. J. Bierwag, P. S. Ho, V. A. Blasche, and R. H. Havemann, 2001 IEEE International Reliability Physics Symposium 39th Annual, 2001, pp. 341-349
5. E. G. Liniger, C. -K. Hu, L. M. Gignac, A. Simon, J. Appl. Phys. 93, 9576 (2003)
6. A. H. Fisher, A. von Glasow, S. Penka, F. Ungar, 2003 International Interconnect Technology Conference, 2003, pp. 253-255
7. rd Annual, 2005, pp. 18-23
8. K.-D. Lee, Y.-J. Park, W. R. Hunter, 2005 IEEE International Reliability Physics Symposium 43rd Annual, 2005, pp. 31-35
9. rd Annual, 2005, pp. 191-194
10. J. R. Black, IEEE Trans. Electron Devices, vol.ED-16, pp.338-347 (1969)
11. K.-D. Lee, P. S. Ho, IEEE. Trans. Dev. Mat. ReL, 4, 237 (2004)
12. J. Tong, D. Martini, N. Magtoto, and J. Kelber, J. Vac. Sci. Technol. B 21 (1), pp. 293-300 (2003)
13. C.-C. Yang, D. Edelstein, L. Clevenger, A. Cowley, J. Gill, K. Chanda, A. Simon, T. Dalton, B. Agarwala, E. Cooney III, D. Nguyen, T. Spooner, A. Stamper, International Interconnect Technology Conference, 2005, 7-7