Mechanism for early failure in Cu dual damascene structure

Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003

Volumn , Issue , 2003, Pages 265-267

  Kim, Dae Yong ^a   Wong, S S ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

Copper; Dielectrics; Failure analysis; Infrared detectors; Integrated circuit interconnections; Integrated circuit technology; Microscopy; Microstructure; Scalability; Stress

Indexed keywords

COPPER; DIELECTRIC MATERIALS; ELECTRIC NETWORK ANALYSIS; FAILURE ANALYSIS; INFRARED DETECTORS; INTEGRATED CIRCUITS; MICROSCOPIC EXAMINATION; MICROSTRUCTURE; SCALABILITY; STRESSES;

BARRIER METALS; CONVERGENT ELECTRON BEAMS; DUAL DAMASCENE; DUAL DAMASCENE STRUCTURES; FAST DIFFUSION; INFRARED MICROSCOPE; INTEGRATED CIRCUIT INTERCONNECTIONS; INTEGRATED CIRCUIT TECHNOLOGY;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 4043104983     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2003.1219772     Document Type: Conference Paper

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