Investigation of mechanical stresses in underlying silicon due to lead-tin solder bumps via synchrotron X-ray topography and finite element analysis

Materials Research Society Symposium Proceedings

Volumn 682, Issue , 2001, Pages 144-149

  Kanatharana, J ^a   Perez Camacho J J ^b   Buckley, T ^b   McNally, P J ^a   Tuomi, T ^c   Danilewsky, A N ^d   O'Hare, M ^a   Lowney, D ^a   Chen, W ^a  

^a DUBLIN CITY UNIVERSITY   (Ireland)

^b Leixlip House Hotel   (Ireland)

^c AALTO UNIVERSITY   (Finland)

^d NONE

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; LEAD; SILICON; STRESS ANALYSIS; SYNCHROTRON RADIATION; TIN; X RAYS;

SILICON SUBSTRATE; SOLDER BUMPS; WHITE BEAM SYNCHROTRON X-RAY TOPOGRAPHY;

MICROPROCESSOR CHIPS;

EID: 34249905614     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-682-n5.7     Document Type: Conference Paper

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