Resist stripping process development for porous low-k dielectric materials

IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings

Volumn , Issue , 2003, Pages 142-147

  Xu, Han ^a   Jacobs, Thieu ^b,c   White, Brian ^b   Wolf, P Josh ^b  

^a ULVAC Technologies Inc   (United States)

^b SEMATECH   (United States)

^c PHILIPS RESEARCH LABORATORIES   (Germany)

Author keywords

Low k dielectric; MSQ; OSG; Porous low k; Residue clean; Resist strip; Ultra low k

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ORGANIC POLYMERS; PERMITTIVITY; PLASMA SOURCES; POROUS MATERIALS; REACTIVE ION ETCHING; RESISTORS; STRIPPING (REMOVAL);

RESIST STRIPPING PROCESS; SILOXANE; TURBO MOLECULAR PUMP;

DIELECTRIC MATERIALS;

EID: 0038519699     PISSN: 1523553X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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