Cu-Cu room temperature bonding - Current status of Surface Activated Bonding(SAB)

ECS Transactions

Volumn 3, Issue 6, 2006, Pages 155-163

  Suga, Tadatomo ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP ON CHIP CONFIGURATION; IONIC WAFERS; NANO-ADHESION LAYERS; SURFACE ACTIVATED BONDING(SAB);

ELECTRONICS PACKAGING; LOW TEMPERATURE OPERATIONS; LSI CIRCUITS; NANOSTRUCTURED MATERIALS; SURFACE REACTIONS;

WAFER BONDING;

EID: 34249294062     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2357065     Document Type: Conference Paper

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