Reliable small via interconnects made of multiple sub-micron wires in flexible PCB

Journal of Micromechanics and Microengineering

Volumn 17, Issue 4, 2007, Pages 700-708

  Yousef, Hanna ^a   Hjort, Klas ^a   Lindeberg, Mikael ^a  

^a UPPSALA UNIVERSITY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE; ELECTRODEPOSITION; ION BOMBARDMENT; LITHOGRAPHY; METALLIZING; PRINTED CIRCUIT BOARDS; SURFACE MICROMACHINING;

DOUBLE-SIDED SURFACE METALLIZATION; INTERCONNECTION LITHOGRAPHY; SUB-MICRON WIRES;

ELECTRIC WIRE;

EID: 34249047993     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/17/4/005     Document Type: Conference Paper

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