SCOPUS 정보 검색 플랫폼

International Journal of Advanced Manufacturing Technology

Volumn 24, Issue 7-8, 2004, Pages 474-484

A study of microvias produced by laser-assisted seeding mechanism in blind via hole plating of printed circuit board

(3) Leung, E S W a Yung, W K C a Lee, W B a

a HONG KONG POLYTECHNIC UNIVERSITY (Hong Kong)

Author keywords

Laser assisted seeding; Microvia; Printed circuit board

Indexed keywords

BLIND VIA; CHEMICAL SOLUTIONS; DEPOSITION MECHANISM; ELECTROLESS COPPER PLATING; ELECTROLESS PLATING PROCESS; HIGH ASPECT RATIO; INTERNAL WALLS; LASER-ASSISTED; MICROVIAS; MICROVIAS DIELECTRIC; THERMAL RELIABILITY; THIN COPPER FILM LAYERS;

ASPECT RATIO; COPPER; COPPER PLATING; ELECTRIC NETWORK ANALYSIS; ELECTROLESS PLATING; PRINTED CIRCUIT MANUFACTURE;

PRINTED CIRCUIT BOARDS;

EID: 34249091152 PISSN: 02683768 EISSN: 14333015 Source Type: Journal
DOI: 10.1007/s00170-003-1583-4 Document Type: Article

Times cited : (8)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.