Excimer laser microvia-technology in multichip modules

Applied Surface Science

Volumn 208-209, Issue 1, 2003, Pages 171-176

  Manirambona, Boniface ^a   De Baets, Johan ^a   Vervaet, Alfons ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

Excimer laser; Microvia; Multichip module; Printed circuit board

Indexed keywords

CHIP SCALE PACKAGES; DIELECTRIC MATERIALS; ELECTRODEPOSITION; EXCIMER LASERS; LASER ABLATION; MICROELECTRONICS; FLIP CHIP DEVICES; LAMINATES; ORGANIC COATINGS; PRINTED CIRCUIT BOARDS; SURFACE MOUNT TECHNOLOGY;

MICROVIAS; DIRECT CHIP ATTACHMENTS (DCA);

MULTICHIP MODULES;

EID: 0037443203     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(02)01362-4     Document Type: Conference Paper

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