Sophisticated HDI flexible substrates for advanced applications

Circuit World

Volumn 29, Issue 3, 2003, Pages 14-17

  Stampanoni, M ^a  

^a Dyconex Ltd   (Switzerland)

Author keywords

Interconnection; Printed circuit boards

Indexed keywords

ELECTRONICS PACKAGING; LASERS; PLASMAS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SUBSTRATES; TELECOMMUNICATION INDUSTRY;

CHIP SIZE PACKAGES; HIGH-DENSITY INTERCONNECT; LASER DIRECT IMAGING; THERMAL DIRECT IMAGING;

INTERCONNECTION NETWORKS;

EID: 0037237754     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120310460766     Document Type: Article

References (4)

1. Schmidt, W. (1992), "A revolutionary answer to today's and future interconnect challenges", Proceedings of the Third European Joint Conference (EIPC), Brussels, Belgium.
2. Schmidt, W. (1996), "DYCOstrate® technology", Circuitree.
3. Stampanoni, M. and Schmidt, W. (2000), "Modern interconnect solutions for miniaturized medical electronic devices", Proceedings of the 2000 International Conference on High-Density Interconnect and Systems Packaging, 25-28 April 2000, Denver, CO, USA.
4. Stampanoni, W. and Schmidt, W. (2001). "Plasma processed flexible and rigid-flexible HDI structures", The Board Authority.