Evaluation of lead-free eutectic Sn-Ag solder for automotive electronics packaging applications

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 1, Issue , 1994, Pages 25-37

  Shangguan, Dongkai ^a   Achari, Achyuta ^a  

^a FORD MOTOR COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOBILE ELECTRONIC EQUIPMENT; ELECTROMIGRATION; ELECTRONICS PACKAGING; ENVIRONMENTAL IMPACT; EUTECTICS; METALLURGY; RELIABILITY; SILVER ALLOYS; TIN ALLOYS;

COMPONENT TERMINATION; CONDUCTOR; DENDRITIC GROWTH; LEAD FREE EUTECTIC SOLDER; METALLURGICAL INTERACTIONS; SOLDER REFLOW;

SOLDERING ALLOYS;

EID: 0028758089     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)