Design and properties of new, Pb-free solder alloys

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 1, Issue , 1994, Pages 7-14

  McCormack, M ^a   Jin, S ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; EUTECTICS; MECHANICAL PROPERTIES; MELTING; METALLOGRAPHIC MICROSTRUCTURE; METALLURGY; TIN ALLOYS; TOXICITY;

ENVIRONMENTAL PROTECTION AGENCY; LEAD FREE SOLDER ALLOYS; MELTING POINT; MELTING TEMPERATURE;

SOLDERING ALLOYS;

EID: 0028745963     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)