Eutectic solder bumped flip chip development

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1997, Pages 319-325

  Akashi, T ^a   Chikai, T ^a   Hamano, T ^a   Yoshida, A ^a   Honma, S ^a   Aoki, H ^a   Miyata, M ^a   Ezawa, K ^a   Makita, T ^a   Miyaoka, M ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; EUTECTICS; FLIP CHIP DEVICES; POLISHING; SOLDERED JOINTS; SOLDERING;

WAFER SORTING PROCESS;

ELECTRONICS PACKAGING;

EID: 0031362907     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)