Au/Sn solder for face-down bonding of AlGaAs/GaAs ridge waveguide laser diodes

Materials Letters

Volumn 58, Issue 21, 2004, Pages 2695-2699

  Tew, J W R ^a   Shi, X Q ^b   Yuan, S ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Au Sn solder; Face down bonding; Intermetallic alloys and compounds; Laser diode; Mechanical properties; Microstructure

Indexed keywords

CRYSTAL MICROSTRUCTURE; ENERGY DISPERSIVE SPECTROSCOPY; HEAT FLUX; INTERFACES (MATERIALS); SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING GALLIUM COMPOUNDS; SOLDERED JOINTS; WAVEGUIDES;

FACE-DOWN BONDING; HIGH TEMPERATURE BONDING; INTERMETALLIC ALLOYS;

SEMICONDUCTOR DIODES;

EID: 3142708674     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2004.03.044     Document Type: Article

References (11)

1. Merritt S.A., Heim P.J.S., Cho S.H., Dagenais M. IEEE Trans. Compon. Packag. Manuf. Technol. Part B, Adv. Packag. 20:1997;141.
2. Shi X.Q., Pang H.L.J., Zhou W., Wang Z.P. Int. J. Fatigue. 22:2000;217.
3. Shi X.Q., Pang H.L.J., Zhou W., Wang Z.P. Scr. Mater. 41:1999;289.
4. Darveaux R., Banerji K. IEEE Trans. Components Hybrids Manuf. Technol. A. 15:1992;1013.
5. So W.W., Chin C.C. IEEE Trans. Compon. Packag. Technol. 23:2000;377.
6. Lee C.C., Wang C.Y., Matijasevic G.S. IEEE Trans. Components Hybrids Manuf. Technol. 14:1991;407.
7. Test methods and procedures for microelectronics, in standard MIL-STD227 883C. Method. 2019:1983 Aug.
8. Okamoto H., Massalski T.B. Binary Alloy Phase Diagrams. 1990;ASM Int, Metal Park.
9. Yoon S.W., Choi W.K., Lee H.M. Scr. Mater. 40:1999;297.
10. Shi X.Q., Kwan H.F., Nai S.M.L., Lim G.H. J. Mater. Sci. 39:2004;1095.
11. Bellcore Reliability Assurance practices for Optoelectronic Devices in Loop Applications, in Standard TA-TSY-000983, Jan 1990.