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Materials Transactions

Volumn 46, Issue 11, 2005, Pages 2400-2405

Microstructural evolution of joint interface Between eutectic 80Au-20Sn solder and UBM

(5) Kim, Sung Soo a Kim, Jong Hoon a Booh, Seong Woon b Kim, Tae Gyu b Lee, Hyuck Mo a

a Korea Advanced Institute of Science and Technology (KAIST) (South Korea)

b Samsung Advanced Institute of Technology (SAIT) (South Korea)

Author keywords

(Au,Ni)3Sn2 grains; Aluminum nickel(varadium) gold metallization; Au 8Al3 phase; Eutectic 80 gold 20 tin solder; Volume expansion

Indexed keywords

EUTECTICS; GOLD; INTERMETALLICS; MICROSTRUCTURE; SPUTTERING; TIN;

(AU,NI)3SN2 GRAINS; ALUMINUM/NICKEL(VARADIUM)/GOLD METALLIZATION; AU8AL3 PHASE; EUTECTIC 80 GOLD-20 TIN SOLDER; VOLUME EXPANSION;

SOLDERING;

EID: 30844440548 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.46.2400 Document Type: Article

Times cited : (19)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.