Morphology control of copper growth on TiN and TaN diffusion barriers in seedless copper electrodeposition

Journal of the Electrochemical Society

Volumn 154, Issue 4, 2007, Pages

  Kim, Sunjung ^a   Duquette, David J ^a,b  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

CONCENTRATION (PROCESS); CRYSTAL STRUCTURE; CYCLIC VOLTAMMETRY; ELECTRIC RESISTANCE; ELECTRODEPOSITION; SEMICONDUCTOR GROWTH; TITANIUM NITRIDE;

ELECTROCHEMICAL DEPOSITION; ONE-STEP DEPOSITION; POTENTIAL SWEEP; TWO-STEP DEPOSITION;

COPPER COMPOUNDS;

EID: 33947140390     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2433703     Document Type: Article

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