Dry etch challenges of 0.25 μm dual damascene structures

Microelectronic Engineering

Volumn 37-38, Issue , 1997, Pages 59-65

  Schnabel, R F ^a   Dobuzinsky, D ^a   Gambino, J ^a   Muller, K P ^a   Wang, F ^a   Perng, D C ^a   Palm, H ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANTIREFLECTION COATINGS; DIELECTRIC MATERIALS; DRY ETCHING;

DUAL DAMASCENE STRUCTURES;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0031273810     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(97)00094-4     Document Type: Article

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