Growth of conformal copper films on TaN by electrochemical deposition for ULSI interconnects

Surface and Coatings Technology

Volumn 201, Issue 6, 2006, Pages 2712-2716

  Kim, Sunjung ^a   Duquette, David J ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

Copper; Seedless electrodeposition; Surface morphology; Tantalum nitride; Tantalum pentoxide; Thin film growth

Indexed keywords

COPPER; ELECTROCHEMISTRY; ELECTROLYTES; ETCHING; FILM GROWTH; MORPHOLOGY; TANTALUM COMPOUNDS; THIN FILMS; ULSI CIRCUITS;

ELECTROCHEMICAL DEPOSITION; SEEDLESS COPPER ELECTROCHEMICAL DEPOSITION; TANTALUM NITRIDE; TANTALUM PENTOXIDE;

ELECTRODEPOSITION;

COPPER; ELECTROCHEMISTRY; ELECTRODEPOSITION; ELECTROLYTES; ETCHING; FILM GROWTH; MORPHOLOGY; TANTALUM COMPOUNDS; THIN FILMS; ULSI CIRCUITS;

EID: 33751001747     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2006.05.022     Document Type: Article

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