Shear strength of fluxless solder joints between Sn and in bumps

Key Engineering Materials

Volumn 297-300 II, Issue , 2005, Pages 857-862

  Lee, Seung Hyun ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

Ag capping layer; Fluxless bonding; In bump; Shear strength; Sn bump

Indexed keywords

ENERGY DISPERSIVE SPECTROSCOPY; FLUXES; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; TIN;

AG CAPPING LAYERS; FLUXLESS BONDING; IN BUMPS; SN BUMPS;

SOLDERED JOINTS;

EID: 33847759804     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-978-4.857     Document Type: Conference Paper

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