Effects of electrical and thermal phenomena on the evolution of adhesion at contact interfaces of electrostatically activated surface microstructures

Applied Physics Letters

Volumn 90, Issue 9, 2007, Pages

  Timpe, S J ^a   Komvopoulos, K ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC BREAKDOWN; ELECTRIC CURRENTS; ELECTRIC POTENTIAL; ELECTRIC PROPERTIES; ELECTROSTATICS; INTERFACES (MATERIALS); MICROSTRUCTURE; THERMODYNAMIC PROPERTIES;

ADHESION FORCE; CURRENT FLOW; ELECTRICAL ACTUATION; ELECTROSTATIC ATTRACTION;

ADHESION;

EID: 33847684653     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2709988     Document Type: Article

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