Scaling of statistical and physical electromigration characteristics in Cu interconnects

Materials Research Society Symposium Proceedings

Volumn 914, Issue , 2006, Pages 305-316

  Gall, Martin ^a   Hauschildt, Meike ^a   Justison, Patrick ^a   Ramakrishna, Koneru ^a   Hernandez, Richard ^a   Herrick, Matthew ^a   Michaelson, Lynne ^b   Kawasaki, Hisao ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

^b Vishay   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COPPER; EXTRAPOLATION; INTERFACES (MATERIALS); OPTICAL INTERCONNECTS; PASSIVATION; STATISTICAL METHODS;

BACKEND PROCESS; CONTINUING DEVICE SCALING; ELECTROMIGRATION (EM) FAILURE RISK; LOGNORMAL STANDARD DEVIATION;

ELECTROMIGRATION;

EID: 33749595650     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-0914-f06-01     Document Type: Conference Paper

References (17)

1. C.-K. Hu, R. Rosenberg, H.S. Rathore, D.B. Nguyen, B. Agarwala, Proc. IEEE Int. Interconnect Technology Conf., 267-269, (1999).
2. C.S. Hau-Riege, C.V. Thompson, Appl. Phys. Lett. 78 (22), 3451-3453, (2001).
3. E.T. Ogawa, K.-D. Lee, V.A. Blaschke, P.S. Ho, IEEE Transactions on Reliability, 51 (4), 403-419, (2002).
4. E. Zschech, H. Geisler, I. Zienert, H. Prinz, E. Langer, M.A. Meyer, G. Schneider, Proc. Adv. Met. Conf., San Diego, 305-311, (2002).
5. M. Hauschildt, M. Gall, S. Thrasher, P. Justison, L. Michaelson, R. Hernandez, H. Kawasaki, P.S. Ho, AIP Conf. Proc. of Stress Induced Phenomena in Metallization 741, 112-123, (2004).
6. M. Hauschildt, Ph.D. Dissertation, The University of Texas at Austin, 2005.
7. J. He, G. Xu, Z. Suo, AIP Conf. Proc. of Stress Induced Phenomena in Metallization 741, 15-26, (2004).
8. J. Sommer, T. Muschik, C. Herzig, W. Gust, Acta mater. 44 (1), 327-334, (1996).
9. M.A. Meyer, M. Herrmann, E. Langer, E. Zschech, Microelectronics Engineering, 64, 375, (2002).
10. E. Liniger, L. Gignac, C.-K. Hu, S. Kaldor, J. Appl. Phys. 92 (4), 1803-1810, (2002).
11. E. Zschech, M.A. Meyer, E. Langer, Proc. of Mater. Research Soc. Symp., 812, 361-372, (2004).
12. R. Rosenberg, D.C. Edelstein, C.-K. Hu, K.P. Rodbell, Annu. Rev. Mater. Sci., 30, 229-262, (2000).
13. M. Gall et al., AIP Conf. Proc. of Stress Induced Phenomena in Metallization 741, 73-84, (2004).
14. M. Gall et al., Electrochem. Soc. Proc., Vol. 2001-2, 410-425, (2001).
15. C.-K. Hu et al., Appl. Phys. Lett. 81 (10), 1782-1784, (2002).
16. C.-K. Hu et al., Proc. IEEE Int. Rel. Phys. Symp., 222-228, (2004).
17. L. Michaelson, M. Gall, P. Fejes, M. Hauschildt, S. Garcia, K. Kim, V. Mathew, E. Acosta, Z.-X. Jiang, to be published in Proc. Adv. Met. Conf., Kyoto (2005).