Evaluation of adhesion strength of Ti films on Si(100) by the internal stress method

Thin Solid Films

Volumn 317, Issue 1-2, 1998, Pages 165-168

  Kinbara, A ^a   Kusano, E ^a   Kamiya, T ^b   Kondo, I ^b   Takenaka, O ^b  

^a KANAZAWA INSTITUTE OF TECHNOLOGY   (Japan)

^b NIPPON DENSO   (Japan)

Author keywords

Adhesion strength; Internal stress method; Ti films

Indexed keywords

ADHESION; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); ION BOMBARDMENT; RESIDUAL STRESSES; SEMICONDUCTING SILICON; STRENGTH OF MATERIALS; STRESS CONCENTRATION; THICKNESS MEASUREMENT; TITANIUM;

ADHESION STRENGTH; INTERNAL STRESS METHOD; TITANIUM FILM;

THIN FILMS;

EID: 0032045524     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(97)00514-2     Document Type: Article

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