Complex electrical (impedance/dielectric) properties of electroceramic thin films by impedance spectroscopy with interdigital electrodes

Thin Solid Films

Volumn 515, Issue 11, 2007, Pages 4588-4595

  Kidner, N J ^a   Meier, A ^a   Homrighaus, Z J ^a   Wessels, B W ^a   Mason, T O ^a   Garboczi, E J ^b  

^a Northwestern University   (United States)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

Barium titanate films; Farnell; Impedance spectroscopy; Interdigital electrodes

Indexed keywords

CAPACITANCE; CAPACITORS; COMPUTER SIMULATION; DIELECTRIC PROPERTIES; ELECTRIC IMPEDANCE; ELECTRODES; FINITE DIFFERENCE METHOD; SPECTROSCOPIC ANALYSIS;

BARIUM TITANATE FILMS; FARNELL; IMPEDANCE SPECTROSCOPY (IS); INTERDIGITAL ELECTRODES (IDE);

MAGNETIC THIN FILMS;

EID: 33847134457     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.11.038     Document Type: Article

References (44)

1. Irvine J.T.S., Sinclair D.C., and West A.R. Adv. Mater. 2 (1990) 132
2. Mason T.O., Hwang J.-H., Mansourian-Hadavi N., Gonzalez G.B., Ingram B.J., and Homrighaus Z.J. In: Knauth P., and Schooman J. (Eds). Impedance Spectroscopy of Nanophase Ceramics, Nanocrystalline Materials: Synthesis and Characterization (2001), Kluwer US, Paris
3. Lee J., Hwang J.-H., Mashek J.J., Mason T.O., Miller A.E., and Siegel R.W. J. Mater. Res. 10 (1996) 2295
4. Pasierb P., Komorknicki S., Gajerski R., Kozinski S., Tomczyk P., and Rekas M. J. Electroceram. 8 (2002) 49
5. Preis W., Bürgermeister A., Sitte W., and Supancic P. Solid State Ionics 173 (2004) 69
6. Hwang J.-H., McLachlan D.S., and Mason T.O. J. Electroceram. 3 (1999) 7
7. Huanosta A., and West A.R. J. Appl. Phys. 61 (1987) 5386
8. Peláiz-Barranco A., Gutiérrez-Amador M.P., Huanosta A., and Valenzuela R. Appl. Phys. Lett. 73 (1998) 2039
9. Wessels B.W. Annu. Rev. Mater. Sci. 25 (1995) 525
10. Daglish M., and Kemmitt T. IPENZ Trans. 27 (2000) 21
11. Abe K., and Komatsu S. Jpn. J. Appl. Phys. 32 (1993) L1157
12. Wang Z., and Oda S. J. Electrochem. Soc. 147 (2000) 4615
13. Yano Y., Iijima K., Daitoh Y., Terashima T., Bando Y., Watanabe Y., Kasatani H., and Terauchi H. J. Appl. Phys. 76 (1994) 7833
14. Laha A., and Krupanidhi S.B. Microelectron. Eng., B 98 (2003) 204
15. Farnell G., Cermak I.A., Silvester P., and Wong S.K. IEEE Trans. Sonics Ultrason. 17 (1970) 188
16. Prume K., Hoffmann S., and Waser R. Integr. Ferroelectr. 32 (2001) 63
17. Wei J.S. IEEE J. Quantum Electron. 13 (1977) 152
18. Gevorgian S., Carlsson E., Rudner S., Wernlund L.-D., Wang X., and Helmersson U. IEE Proc., Microw. Antennas Propag. 143 (1996) 396
19. Hoerman B.H., Ford G.M., Kaufmann L.D., and Wessels B.W. Appl. Phys. Lett. 73 (1998) 2248
20. Al-Shareef H.N., Dimos D., Raymond M.V., Schwartz R.W., and Mueller C.H. J. Electroceram. 1 (1997) 145
21. Chattopadhyay S., Teren A.R., Hwang J.-H., Mason T.O., and Wessels B.W. J. Mater. Res. 17 (2002) 161
22. Pond J.M., Kirchoefer S.W., Chang W., Horwitz J.S., and Chirsey D.B. Integr. Ferroelectr. 22 (1998) 317
23. Shiosaki T., Adachi M., Mochizuki S., and Kawabata A. Ferroelectrics 63 (1985) 227
24. Kidner N.J., Homrighaus Z.J., Mason T.O., and Garboczi E.J. Thin Solid Films 496 (2005) 539
25. Meril F., Collard V., Debeda H., and Lucat C. Sens. Actuators, B, Chem. 77 (2001) 84
26. Song Z.T., Chan H.L.W., Choy C.L., and Lin C.L. Microelectron. Eng. 66 (2003) 887
27. Gilbert S.R., Wills L.A., Wessels B.W., Schindler J.L., Thomas J.A., and Kannewurf C.R. J. Appl. Phys. 80 (1996) 969
28. Zhao T., Chen Z.-H., Chen F., Lu H.-B., and Yang G.-Z. Appl. Phys. Lett. 77 (2000) 4338
29. Kim K., Kwon Y.W., Norton D.P., Christen D.K., Budai J.D., Sales B.C., Chisholm M.F., Cantoni C., and Marken K. Solid-State Electron. 47 (2003) 2177
30. Pakhomov Gl., Shashkin V.I., Pozdnyaev D.E., Muller C., and Ribo J.-M. Org. Electron. 3 (2002) 93
31. Díaz-Flores L.L., Ramírez-Bon R., Mendoza-Galván A., Prokhorov E., and González-Hernádez J. J. Phys. Chem. Solids 64 (2003) 1037
32. Ivanovskaya M.I., Bogdanov P.A., Orlik D.R., Gurlo A.Ch., and Romanovskaya V.V. Thin Solid Films 296 (1997) 41
33. Garboczi E.J. NIST Intern. Rep. 6269 (1998)
34. Bohn R.B., and Garboczi E.J. NIST Intern. Rep. 6997 (2003)
35. Torrents J.M., Mason T.O., Peled A., Shah S.P., and Garboczi E.J. J. Mater. Sci. 36 (2001) 4003
36. Kidner N.J., Homrighaus Z.J., Ingram B.J., Mason T.O., and Garbozi E.J. J. Electroceram. 14 (2005) 283
37. Kidner N.J., Homrighaus Z.J., Ingram B.J., Mason T.O., and Garbozi E.J. J. Electroceram. 14 (2005) 293
38. Towner D.J., Ni J., Marks T.J., and Wessels B.W. J. Cryst. Growth 225 (2003) 107
39. Certain commercial equipment and/or materials are identified in this report in order to adequately specify the experimental procedure. In no case does such identification imply recommendation or endorsement by the National Institute of Standards and Technology, nor does it imply that the equipment and/or materials used are necessarily the best available for the purpose.
40. Edwards D.D., Hwang J.-H., Ford S.J., and Mason T.O. Solid State Ionics 99 (1997) 85
41. Gopalan V., and Raj R.J. J. Am. Ceram. Soc. 78 (1995) 1825
42. Hirose N., and West A.R. J. Am. Ceram. Soc. 79 (1996) 1633
43. Clark I.J., Marques F.B., and Sinclair D.C. J. Eur. Ceram. Soc. 22 (2002) 579
44. Thomas R., Varadan V.K., Komarneni S., and Dube D.C. J. Appl. Phys. 90 (2001) 1480