Vacancy-induced plastic deformation in electrodeposited copper films

Journal of the Electrochemical Society

Volumn 154, Issue 3, 2007, Pages

  Nakahara, S ^a,b   Ahmed, S ^a,b   Ahmed, T T ^a   Buckley, D N ^a,b  

^a UNIVERSITY OF LIMERICK   (Ireland)

^b ELECTROCHEMICAL SOCIETY   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

BIAXIAL TENSILE STRESS; COPPER FILMS; VACANCY CONCENTRATION;

COPPER; ELECTRODEPOSITION; GRAIN BOUNDARIES; METALLIC FILMS; TENSILE STRESS;

PLASTIC DEFORMATION;

EID: 33846998682     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2429033     Document Type: Article

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