A model for spontaneous morphology change in electrodeposited metal films during room-temperature aging

Electrochemical and Solid-State Letters

Volumn 10, Issue 2, 2007, Pages

  Nakahara, S ^a,b   Ahmed, S ^a,b   Buckley, D N ^a,b  

^a UNIVERSITY OF LIMERICK   (Ireland)

^b ELECTROCHEMICAL SOCIETY   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

FILM SURFACES; GOLD FILMS; SURFACE CRACKS; VACANCY DIFFUSION;

AGING OF MATERIALS; COPPER; CRACK PROPAGATION; ELECTRODEPOSITION; MATHEMATICAL MODELS; MORPHOLOGY; POLYCRYSTALLINE MATERIALS; TENSILE STRESS;

METALLIC FILMS;

EID: 33845928426     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2400725     Document Type: Article

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