Cooling of power electronics by embedded solids

Journal of Electronic Packaging

Volumn 128, Issue 4, 2006, Pages 388-397

  Dirker, J ^a   Van Wyk, J D ^a,b   Meyer, J P ^c  

^a UNIVERSITY OF JOHANNESBURG   (South Africa)

^b VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^c UNIVERSITY OF PRETORIA   (South Africa)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM NITRIDE; ELECTRONIC EQUIPMENT; EMBEDDED SYSTEMS; FERRITES; HEAT RESISTANCE; MAGNETIC FLUX; MATHEMATICAL MODELS; THERMAL CONDUCTIVITY;

EMBEDDED SOLIDS; MAGNETIC FLUX DENSITY; THERMAL INTERFACIAL RESISTANCE;

POWER ELECTRONICS;

EID: 33846688105     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2351903     Document Type: Article

References (24)

1. Avenas, Y., Ivanova, M., Popova, N., Schaeffer, C., Schanen, J-L., and Bricard, A., 2002, "Thermal Analysis of Thermal Spreaders Used in Power Electronics Cooling," Conference Record of the 37th I.E.E.E. Industry Applications Conference, October 13-18, Vol. 1, pp. 216-221.
2. Bagnoli, P. E., Casarosa, C., and Dallago, E., 1998a, "Thermal Resistance Analysis by Induced Transient (TRAIT) Method for Power Electronic Devices Thermal Characterization. Part I: Fundamentals and Theory," IEEE Trans. Power Electron., 13(6), pp. 1208-1219.
3. Shidore, S., Adams, V., and Tien-Yu, T. L., 2001, "A Study of Compact Thermal Model Topologies in CFD for a Flip Chip Plastic Ball Grid Array Package," IEEE Trans. Compon. Packag. Technol., 24(2), pp. 191-198.
4. Zhao, C. Y., and Lu, T. J., 2002, "Analysis of MicroChannel Heat Sinks for Electronics Cooling," Int. J. Heat Mass Transfer, 45(24), pp. 4857-4869.
5. Strydom, J. T., and Van Wyk, J. D., 2002, "Electromagnetic Design Optimisation of Planar Integrated Passive Modules," Proceedings of the 33rd I.E.E.E. Power Electronics Specialist Conference (PESC), Australia, June 23-27, Vol. 2, pp. 573-578.
6. Chen, P.-C., and Lin, W-K., 2002, "The Application of Capillary Pumped Loop for Cooling of Electronic Components," Comput. Struct., 80(1), pp. 23-30.
7. Barbosa, P., Lee, F. C., Van Wyk, J. D., Boroyevich, D., Scott, E., Thole, K., Odendaal, H., Liang, Z., Pang, Y., Sewell, E., Chen, J., and Yang, B., 2002, "An Overview of IPEM-Based Modular Implementation for Distributed Power Systems," Center for Power Electronics Systems (CPES) Power Electronics Seminar, Virginia Tech, Blacksburg, VA, pp. 70-76.
8. Liu, X., and Lu, G-Q., 2000, "Power Electronics Packaging and Miniature Using Chip-Scale Packaged Power Devices," The Third International Power Electronics and Motion Control Conference Proceedings, PIEMC 2000, August 15-18, Vol. 1, pp. 246-251.
9. Van Wyk, J. D., Strydom, J. T., Zhao, L., and Chen, R., 2002, "Review of the Development of High Density Integrated Technology for Electromagnetic Power Passives," Proceedings of the 2nd International Conference on Integrated Power Systems (CIPS), June 11-12, Bremen, Germany, pp. 25-34.
10. Lee, F. C., Van Wyk, J. D., Boroyevich, D., Jahns, T., Chow, T. P., and Barbosa, P., 2002, "Modularization and Integration as a Future Approach to Power Electronic Systems," Proceedings of the 2nd International Conference on Integrated Power Systems (CIPS), June 11-12, Bremen, Germany, pp. 9-18.
11. Yang, L., Lee, F. C., and Odendaal, W. G., 2003. "Measurement-Based Char acterization Method for Integrated Power Electronics Modules," Eighteenth Annual IEEE Applied Power Electronics Conference and Exposition, APEC '03, February 9-13, Vol. 1, pp. 490-496.
12. Bergles, A. E., 2003, "Evolution of Cooling Technology for Electrical, Electronic, and Microelectronic Equipment," IEEE Trans. Compon. Packag. Technol., 26(1), pp. 6-15.
13. Murthy, S. S., Joshi, Y. K., and Nakayama, W., 2002, "Single Chamber Compact Two-Phase Heat Spreaders with Microfabricated Boiling Enhancement Structures," IEEE Trans. Compon. Packag. Technol., 25(1), pp. 156-163.
14. Kercher, D. S., Lee, J., Brand, O., Allen, M. G., and Glezer, A., 2003, "Microjet Cooling Devices for Thermal Management of Electronics," IEEE Trans. Compon. Packag. Technol., 26(2), pp. 359-366.
15. Chien, T., Lee, D., Ding, P., Chiu, S., and Chen, P., 2003, "Disk-Shaped Miniature Heat Pipe (DMHP) With Radiating Micro Grooves for a TO Can Laser Diode Package," IEEE Trans. Compon. Packag. Technol., 26(3), pp. 569-574.
16. Moon, S., Yun, H., Hwang, G., and Choy, T., 2001, "Experimental Study on the Performance of Miniature Heat Pipes With Woven-Wire Wick," IEEE Trans. Compon. Packag. Technol., 24(4), pp. 591-595.
17. Jones, W. K., Liu, Y., and Gao, M., 2003, "Micro Heat Pipes in Low Temperature Cofire Ceramic (LTCC) Substrates," IEEE Trans. Compon. Packag. Technol., 26(1), pp. 110-115.
18. Gillot, C., Avenas, Y., Cezac, N., Poupon, G., Schaeffer, C., and Fournier, E., 2003, "Silicon Heat Pipes Used as Thermal Spreaders," IEEE Trans. Compon. Packag. Technol., 26(2), pp. 332-339.
19. Dirker, J., Liu, W., van Wyk, J. D., and Meyer, J. P., 2004, "Evaluation of Embedded Heat Extraction for High Power Density Integrated Electromagnetic Power Passives," Proceedings of the 35th IEEE Annual Power Electronics Specialists Conference, June 21-25, Aachen, Germany, pp. 4888-4893.
20. Dirker, J., Liu, W., Malan, A. G., van Wyk, J. D., and Meyer, J. P., 2005, "Embedded Solid State Heat Extraction in Integrated Power Electronics Modules," IEEE Trans. Power Electron., 20(3), pp. 694-703.
21. Liu, W., Van Wyk, J. D., and Dirker, J., 2004, "Power Density Improvement in Integrated Electromagnetic Power Passive Modules With Embedded Heat Extractors," Conference Record, IEEE Industry Applications Annual Conference, October 3-7, pp. 2303-2308.
22. Dirker, J., 2004, "Heat Extraction From Solid State Electronics by Embedded Solids With Application to Integrated Power Electronic Passive Modules," Ph.D. dissertation, Faculty of Engineering, Rand Afrikaans University, Johannesburg, South Africa.
23. Incropera, F. P., and DeWitt, D. P., 1996, Introduction to Heat Transfer, 3rd ed., Wiley, New York, pp. 81.
24. Li, J., Abdallah, T., and Sullivan, C. R., 2001, "Improved Calculation of Core Loss With Nonsinusoidal Waveforms," Proceedings of the 36th I.E.E.E, Industry Applications Conference, Sept. 30-Oct. 4, Vol. 4, pp. 2203-2210.