Analysis of microchannel heat sinks for electronics cooling

International Journal of Heat and Mass Transfer

Volumn 45, Issue 24, 2002, Pages 4857-4869

  Zhao, C Y ^a   Lu, T J ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COOLANTS; COOLING; HEAT FLUX; HEAT PIPES; HEAT TRANSFER; LAMINAR FLOW; NUMERICAL METHODS; NUSSELT NUMBER; POROSITY; POROUS MATERIALS; THERMAL CONDUCTIVITY; TURBULENT FLOW;

DARCY EQUATIONS;

HEAT SINKS;

COOLING; ELECTRONICS INDUSTRY; FORCED CONVECTION; HEAT TRANSFER; MICROCHANNEL; NUSSELT NUMBER; THERMAL CONDUCTIVITY;

EID: 0037120138     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0017-9310(02)00180-1     Document Type: Article

References (16)

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