Thermal analysis of thermal spreaders used in power electronics cooling

Conference Record - IAS Annual Meeting (IEEE Industry Applications Society)

Volumn 1, Issue , 2002, Pages 216-221

  Avenas, Yvan ^a   Ivanova, M ^a   Popova, N ^a   Schaeffer, C ^a   Schanen, J L ^a   Bricard, A ^b  

^a LABORATOIRE D ELECTROTECHNIQUE DE GRENOBLE   (France)

^b CEA GRENOBLE   (France)

Author keywords

Electronics cooling; Heat pipe; Heat spreader; Silicon, sintered powders

Indexed keywords

COMPUTER SIMULATION; COOLING; HEAT FLUX; HEAT LOSSES; HEAT PIPES; HEAT RESISTANCE; HEAT TRANSFER; INSULATED GATE BIPOLAR TRANSISTORS; POWER ELECTRONICS; SILICON; THERMAL CONDUCTIVITY; THERMOANALYSIS;

THERMAL SPREADERS;

SPREADERS;

EID: 0036444418     PISSN: 01972618     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Mehl D., "Vapor Chamber Heat Sinks for Power Semiconductors", http://www.thermacore.com/pdfs/vapor.pdf.
2. Hopkins R., Faghri A., Khrustalev D., "Flat Miniatures Heat Pipes With Micro Capillary Grooves", Journal of Heat Transfer, Vol. 121, Feb. 1999, pp. 102-109.
3. Cao Y., Gao M., Beam J.E., Donovan B., "Experiments and Analyses of Flat Miniature Heat Pipes", Journal of Thermophysics and Heat Transfer, Vol. 11, Apr-Jun 1997, pp. 158-164.
4. Faghri A., "Heat Pipe Science and Technology", Taylor and Francis, 1995.
5. Mehl D., Dussinger P., Grubb K., "Use of Vapor Chambers for Thermal Management", http://www.thermacorc.com/pdfs/vapor_chambers.pdf.
6. st Annual Spacecraft Thermal Control Symposium, November 16-18, 1994; Albuquerque, NM, USA.
7. Benson D.A., Mitchell R.T., Tuck M.R., Palmer D.W., Peterson G.P., "Ultrahigh Capacity Micromachined Heat Spreaders", Microscale Thermophysical Engineering, Vol. 2, 1998, pp. 21-30.
8. th THERMINIC Workshop pp. 130-135, 2001, Pads, France.