Evaluation of embedded heat extraction for high power density integrated electromagnetic power passives

PESC Record - IEEE Annual Power Electronics Specialists Conference

Volumn 6, Issue , 2004, Pages 4888-4893

  Dirker, J ^a   Liu, W ^b   Van Wyk, J D ^b   Meyer, J P ^c  

^a UNIVERSITY OF JOHANNESBURG   (South Africa)

^b VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^c UNIVERSITY OF PRETORIA   (South Africa)

Author keywords

[No Author keywords available]

Indexed keywords

EMBEDDED HEAT EXTRACTION; HIGH POWER DENSITY; POWER PASSIVES;

ELECTROMAGNETIC WAVE EMISSION; EMBEDDED SYSTEMS; HEAT CONDUCTION; HEAT EXCHANGERS; INTEGRATED CIRCUIT LAYOUT; PASSIVE NETWORKS; POWER ELECTRONICS; SOLID STATE DEVICE STRUCTURES;

POWER CONVERTERS;

EID: 8744242278     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PESC.2004.1354864     Document Type: Conference Paper

References (7)

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2. Strydom, J.T., and Van Wyk, J.D., Electromagnetic design optimisation of planar integrated passive modules, Proceedings of the 33rd I.E.E.E. Power Electronics Specialist Conference (PESC), Australia, Vol. 2, June 2002, pp. 573-578
3. Strydom, J.T., Van Wyk, J.D., and Ferreira, J.A., Some units of integrated L-C-T modules at 1MHz, I.E.E.E Transactions on Industry Applications, Vol. 37, No. 3, May/June 2001, pp. 820-828
4. Dirker, J., and Meyer, J.P., Optimum rectangular embedded cooling structure shapes in heat generating mediums - A two-dimensional approach. Proceedings of the 2nd International Conference on Heat Transfer, Fluid Mechanics, and Thermodynamics, (HEFAT 2003), Livingstone, Zambia, 23 - 25 June 2003, Paper No. DJ1
5. Dirker, J., Liu, W., Van Wyk, J.D., and Meyer, J.P., High Power Density Electromagnetic Modules with Embedded Heat Extractors, Proceedings of the Center for Power Electronics Systems (CPES) Power Electronics Seminar, Virginia Tech, Blacksburg, VA 24061, 2004, pp. 159, Paper No. C164
6. Li, J., Abdallah, T., and Sullivan, C.R., Improved calculation of core loss with nonsinusoidal wafeforms, Proceedings of the 36th I.E.E.E.Industry Applications Conference, Vol 4, 30 Sept. - 4 Oct. 2001,pp 2203-2210
7. Liu, W., Van Wyk, J.D.,and Odendaal, W.G., High density integrated electromagnetic power passives with vertical interconnect and stacked structure, Proceedings of the 34th I.E.E.E. Power Electronics Specialist Conference (PESC), Vol. 2, 15-19 June 2003, pp. 442-447