Power electronics packaging and miniature using chip-Scale packaged power devices

Proceedings - IPEMC 2000: 3rd International Power Electronics and Motion Control Conference

Volumn 1, Issue , 2000, Pages 246-251

  Liu, Xingsheng ^a   Lu, Guo Quan ^a  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; MICROPROCESSOR CHIPS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; MOTION CONTROL; POWER ELECTRONICS; SOLDERED JOINTS; SOLDERING ALLOYS;

CHIP SCALE PACKAGED; ELECTRICAL CHARACTERISTIC; HIGH CURRENT HANDLING CAPABILITY; HIGH-DENSITY PACKAGING; INTEGRATED POWER ELECTRONICS MODULE; INTERCONNECT POWER; LATERAL DIMENSION; PACKAGING STRUCTURE;

POWER CONTROL;

EID: 33846670935     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IPEMC.2000.885365     Document Type: Conference Paper

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