Test methods for silicon die strength

Journal of Electronic Packaging

Volumn 128, Issue 4, 2006, Pages 419-426

  Tsai, M Y ^a   Chen, C H ^a   Lin, C S ^a  

^a CHANG GUNG UNIVERSITY   (Taiwan)

Author keywords

Die strength; Electronic packaging; Failure mode; Four point bending; Point loading; Test method; Wafer thinning

Indexed keywords

ATOMIC FORCE MICROSCOPY; BENDING DIES; FAILURE ANALYSIS; FINITE ELEMENT METHOD; GRINDING (MACHINING); SILICON WAFERS;

FAILURE STRENGTH; FOUR-POINT BENDING; POINT LOADING; STACKED-DIE PACKAGES; WAFER-THINNING;

ELECTRONICS PACKAGING;

EID: 33846662031     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2351907     Document Type: Article

References (10)

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