Interdiffusion and reactions in the Cu/TiN/Si thin film system

Applied Surface Science

Volumn 92, Issue , 1996, Pages 335-339

  Gong, Y S ^a   Lin, Jing Cheng ^a   Lee, Chiapyng ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; AUGER ELECTRON SPECTROSCOPY; COPPER; DIFFUSION; GRAIN BOUNDARIES; INTERFACES (MATERIALS); PHASE EQUILIBRIA; SEMICONDUCTING SILICON; SPUTTER DEPOSITION; TITANIUM NITRIDE; VACUUM APPLICATIONS; X RAY DIFFRACTION;

BARRIER CAPABILITY; INTERDIFFUSION;

THIN FILMS;

EID: 0030562465     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/0169-4332(95)00251-0     Document Type: Article

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