Prediction of delamination in micro-electronic packages

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages

  Van Driel, W D ^a,c   Van Gils, M A J ^a,b   Zhang, G Q ^a,c  

^a NXP SEMICONDUCTORS   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHIP SCALE PACKAGES; CRACKS; DELAMINATION; FINITE ELEMENT METHOD; MOISTURE; NUMERICAL METHODS; THERMAL EXPANSION; VAPOR PRESSURE;

DRIVING MECHANISMS; HYGRO SWELLING; INTERFACIAL DEGRADATION; MICRO-ELECTRONIC PACKAGES;

MICROELECTRONICS;

EID: 33846276530     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564624     Document Type: Conference Paper

References (16)

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