Novel damage model for delamination in Cu/low-k IC backend structures

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 988-994

  Van Gils, M A J ^a   Van Der Sluis, O ^a   Zhang, G Q ^b   Janssen, J H J ^c   Voncken, R M J ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

^c NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CMOS INTEGRATED CIRCUITS; COPPER; FINITE ELEMENT METHOD; RELIABILITY;

BACK END STRUCTURES; BUMPING; DAMAGE MODELS;

DELAMINATION;

EID: 24644452631     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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