Finite element analysis for microwave cure of underfill in flip chip packaging

Thin Solid Films

Volumn 462-463, Issue SPEC. ISS., 2004, Pages 436-445

  Liu, Lie ^a   Yi, Sung ^b   Ong, Lin Seng ^c   Chian, Kerm Sin ^c  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b PORTLAND STATE UNIVERSITY   (United States)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Computer simulation; Microwave; Reaction kinetics

Indexed keywords

EXOTHERMIC CHEMICAL REACTIONS; FLIP CHIP PACKAGING; MICROWAVE CURING;

CALORIMETERS; CURING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; HEAT TRANSFER; MATHEMATICAL MODELS; MICROWAVES; REACTION KINETICS;

CHIP SCALE PACKAGES;

EID: 4344605850     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.060     Document Type: Article

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