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Volumn 27, Issue 10, 2006, Pages 814-816

0.86-nm CET gate stacks with epitaxial Gd2O3 high-κ dielectrics and FUSI NiSi metal electrodes

Author keywords

Epitaxial dielectric; Fully silicided (FUSI); Gd2O3; High k; Metal gate; NiSi; Rare earth oxide

Indexed keywords

EPITAXIAL DIELECTRIC; FULLY SILICIDED (FUSI); GD2O3; HIGH-K; METAL GATE; NISI; RARE EARTH OXIDE;

EID: 33846089635     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2006.882581     Document Type: Article
Times cited : (50)

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    • Highly selective HBr etch process for fabrication of triple-gate nano-scale SOI-MOSFETs
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    • M. C. Lemme, T. Mollenhauer, H. Gottlob, W. Henschel, J. Efavi, C. Welch, and H. Kurz, "Highly selective HBr etch process for fabrication of triple-gate nano-scale SOI-MOSFETs," Microelectron. Eng., vol. 73/74, pp. 346-350, Jun. 2004.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.