A paradigm for interconnect geometry to reduce grain boundary resistance

Journal of Applied Physics

Volumn 100, Issue 12, 2006, Pages

  Josell, D ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL TRANSPORT; GEOMETRICAL PARAMETERS; SIDEWALL ROUGHNESS;

ELECTRIC PROPERTIES; FREE ENERGY; GRAIN BOUNDARIES; PARAMETER ESTIMATION; SURFACE ROUGHNESS; TRANSPORT PROPERTIES;

LARGE SCALE SYSTEMS;

EID: 33846089350     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2401309     Document Type: Article

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