Influence of test conditions on electromigration reliability of Sn-Ag-Cu flip-chip solder interconnects

Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005

Volumn , Issue , 2005, Pages 834-840

  Lai, Yi Shao ^a   Lee, Chiu Wen ^a   Kao, Chin Li ^a   Shao, Yu Hsiu ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Electromigration; Electrothermal coupling analysis; Flip chip; Reliability; Solder bump

Indexed keywords

AVERAGE CURRENT DENSITIES; ELECTROMIGRATION RELIABILITY; ELECTROTHERMAL COUPLINGS; FATIGUE RELIABILITY; FLIP CHIP; MORPHOLOGICAL PATTERNS; SOLDER BUMP; SOLDER INTERCONNECTS;

ELECTROMIGRATION; FATIGUE OF MATERIALS; FLIP CHIP DEVICES; MICROELECTRONICS; RELIABILITY; SILVER; SOLDERING; SOLDERING ALLOYS;

TIN;

EID: 84876896701     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)

1. K. N. Tu, "Recent advances on electro-migration in very-large-scale-integration of interconnects," J. Appl. Phys., 94(9): 5451-5473, 2003.
2. W. J. Choi et al., "Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization," J. Appl. Phys., 94(9): 5665-5671, 2003
3. J. W. Nah et al., "Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints," J. Appl. Phys., 94(12): 7560-7566, 2003.
4. th Int. Symp. Microelectr., Boston, MA, pp. 93-99, 2003.
5. G. A. Rinne, "Issues in accelerated electromigration of solder bumps," Microelectr. Reliab., 43(12): 1975-1980, 2003.
6. T. L. Shao et al., "Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti/Cr-Cu/Cu and Ni(P)/Au metallization pads," J. Appl. Phys., 96(8): 4518-4524, 2004.
7. th Int. Conf. Electr. Mater. Pack., Penang, Malaysia, pp. 314-319, 2004.
8. J.-D. Wu et al., "A study in flip-chip UBM/bump reliability with effects of SnPb solder composition," Microelectr. Reliab., in press.
9. Y.-S. Lai and C.-L. Kao, "Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages," Microelectr. Reliab., in press.
10. Y.-S. Lai and C.-L. Kao, "Characteristics of current crowding in flip-chip solder bumps," Microelectr. Reliab., in press.
11. H. Shaukatullah et al., "A non-dimensional correlation for the external thermal characteristics of surface mount metal quad flat packs," Proc. 1994 InterSoc. Conf. Thermal Phenom. Electr. Sys., Washington, DC, pp. 237-244, 1994.
12. B. M. Guenin et al., "Analysis of a thermally enhanced ball grid array package," IEEE Trans. Comp., Pack., Manuf. Technol. - Part A, 18(4): 749-757, 1995.
13. th IEEE Semicon. Thermal Measure. Manage. Symp., Austin, TX, pp. 24-31, 1997.
14. G. N. Ellison, Thermal Computations for Electronic Equipment, R. E. Krieger, Malabar, 1989.
15. th Electr. Comp. Technol. Conf., Lake Buena Vista, FL, pp. 1421-1426, 2005.
16. H. Ye et al., "Thermomigration in Pb-Sn solder joints under Joule heating during electric current stressing," Appl. Phys. Lett., 82(7): 1045-1047, 2003.