Predictive model for adhesion loss of molding compounds from exposure to humid environments

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1408-1414

  Ferguson, Timothy P ^a   Qu, Jianmin ^b  

^a SOUTHERN RESEARCH INSTITUTE   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACIAL ADHESION; MOISTURE CONCENTRATION; MOISTURE-INDUCED DEGRADATION;

ADHESION; ENERGY DISSIPATION; FRACTURE MECHANICS; INTERFACES (MATERIALS); MOISTURE; RELIABILITY THEORY;

MICROELECTRONICS;

EID: 33845582446     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645841     Document Type: Conference Paper

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