Nonlinear thermal reduced model for power semiconductor devices

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 638-644

  Gatard, Emmanuel ^a   Sommet, Raphaël ^a   Quéré, Raymond ^a  

^a Centre National de la Recherche Scientifique   (France)

Author keywords

3D thermal simulation; High power amplifier; Interpolation formula; Kirchoff transformation; Nonlinear model; Pulsed measurements; Reduction technique; Ritz vector; SPICE subcircuit; Transient temperature simulation

Indexed keywords

COMPUTER SIMULATION; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; POWER AMPLIFIERS; TEMPERATURE CONTROL;

3D THERMAL SIMULATION; HIGH POWER AMPLIFIERS; INTERPOLATION FORMULA; KIRCHOFF TRANSFORMATION; NONLINEAR MODELS; PULSED MEASUREMENTS; REDUCTION TECHNIQUES; RITZ VECTOR; SIMULATION PROGRAM INTEGRATED CIRCUITS ESPECIALLY (SPICE) SUBCIRCUITS; TRANSIENT TEMPERATURE SIMULATION;

SEMICONDUCTOR DEVICES;

EID: 33845580697     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645405     Document Type: Conference Paper

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